Texas A&M International University

Faculty Adviser - DustyMOTOR Student Organization and Team

The organization is part of Society of Automotive Engineers (SWE) International, and it was established in order to build a team of students, faculty, and administrators that have an authentic passion for automobiles including cars, trucks, and motorcycles. The student team participates in the SAE Formula Student challenge.

Texas A&M International University

Assistant Professor of Engineering

Teaching/taught the following courses/topics:
Computer Integrated Manufacturing, Engineering Mechanical Statics, and Dynamics, Engineering Project Management and Proposals, Facilities Design & Logistics, Intro to Control Systems, Measurements and Devices, Production Planning and Control, Systems Engineering Senior Design Project, Systems Simulation, Undergraduate Research: Human Factors and Ergonomics, Robotics, Nano-Technology, and Energy Harvesting.

Texas A&M International University

Faculty Adviser - TAMIU Students for the Exploration and Development of Space (SEDS) Organization

TAMIU SEDS is a student organization at Texas A&M International University, which aims to provide TAMIU students with opportunities to develop their technical and leadership skills and involve them in engineering projects related to Space Exploitation.

Texas A&M International University

Faculty Adviser - Society of Women Engineers (SWE) Student Chapter

SWE purpose is to stimulate women to achieve full potential in careers as engineers and leaders, expand the image of the engineering profession as a positive force in improving the quality of life, and demonstrate the value of diversity.

Texas A&M International University

Faculty Adviser - International Petroleum Student Organization (PETRUM)

The main purpose of International Petroleum Student Organization (PETRUM) is to inform TAMIU’s current and future students about the diversity of fields in the petroleum industry and to provide opportunities for each student to successfully pursue a petroleum engineering minor. PETRUM is open for students of all majors, being the main goal to enrich the students’ knowledge, leadership, and networking skills to accomplish and ensure a successful career in petroleum engineering.

Integrated Electronics Engineering Center (IEEC)

Post-Doctoral Research Assistant

- Manufacturing process development.
- Production quality assessment including verification and validation of the current production and new developed products.
- Worked with couple of local companies in their production and new product development projects like DE Shaw, Elliot Manufacturing and GE.

Integrated Electronics Engineering Center (IEEC)

Doctoral Research Assistant

Electronics manufacturing/assembly process evaluation and development:
- Characterized the current PCB and SMT sensors assembly processes, determined processes’ parameters and provided improvement and recommendations.
- Evaluated and redesigned electronics components to fit the process requirements and restrictions.
- Conducted HAST and environmental testing on new electronics devices.

Production quality Audition:
- Inspected and quality checked for random production samples to verify if the products are within the quality specification limits

IEEE

West Officer of IEEE Corpus Christi Section

Tariq worked at IEEE as a West Officer of IEEE Corpus Christi Section

Society of Hispanic Professional Engineers

Vice President of SHPE Laredo Professional Chapter

Tariq worked at Society of Hispanic Professional Engineers as a Vice President of SHPE Laredo Professional Chapter

Society of Hispanic Professional Engineers

Chair, Advisors Committee - SHPE National Convention 2019 - Advisor Academic Track

Tariq worked at Society of Hispanic Professional Engineers as a Chair, Advisors Committee - SHPE National Convention 2019 - Advisor Academic Track

The Honor Society of Phi Kappa Phi

Secretary of Chapter 296

Tariq worked at The Honor Society of Phi Kappa Phi as a Secretary of Chapter 296

American Red Cross

- Shopper Program
- Blood centers/drive front desk services

Dependence of SnAgCu Solder Joint Properties on Solder Microstructure

Electronic Components & Technology Conference 2011

It is well known that variations in the microstructure of lead free solders greatly affect their thermomechanical properties. Sn grain size, orientation and number, as well as secondary Ag3Sn and Cu6Sn5 precipitate sizes and numbers, are all seen to influence the mechanical response of solder joints during isothermal and thermal cycling. The solidification temperature of a SnAgCu solder joint dramatically affects its microstructure. Generally, smaller solder balls (e.g. CSP) undercool more, and thus their microstructure and properties are very different than larger solder balls (e.g. BGA). We report results of a study of the effects of solder joint volume, and pad sizes, on the microstructure and thermomechanical properties of solder joints. Solder joint shapes and dimensions spanned the ranges typical of BGA and CSP assemblies. Temperatures of solidification during cool-down were quantified by differential scanning calorimetry. Sn grain structures were characterized by crossed polarizer microscopy and scanning electron microscopy with electron backscattered diffraction. Precipitate sizes and distributions were measured using backscattered scanning electron microscopy. Corresponding properties, including hardness, strength and fatigue resistance were measured before and after aging for various lengths of times at temperatures up to 125°C. Smaller solder joints on smaller pads were shown to be harder and stronger than larger ones, but to age faster and eventually end up softer and weaker.

Dependence of SnAgCu Solder Joint Properties on Solder Microstructure

Electronic Components & Technology Conference 2011

It is well known that variations in the microstructure of lead free solders greatly affect their thermomechanical properties. Sn grain size, orientation and number, as well as secondary Ag3Sn and Cu6Sn5 precipitate sizes and numbers, are all seen to influence the mechanical response of solder joints during isothermal and thermal cycling. The solidification temperature of a SnAgCu solder joint dramatically affects its microstructure. Generally, smaller solder balls (e.g. CSP) undercool more, and thus their microstructure and properties are very different than larger solder balls (e.g. BGA). We report results of a study of the effects of solder joint volume, and pad sizes, on the microstructure and thermomechanical properties of solder joints. Solder joint shapes and dimensions spanned the ranges typical of BGA and CSP assemblies. Temperatures of solidification during cool-down were quantified by differential scanning calorimetry. Sn grain structures were characterized by crossed polarizer microscopy and scanning electron microscopy with electron backscattered diffraction. Precipitate sizes and distributions were measured using backscattered scanning electron microscopy. Corresponding properties, including hardness, strength and fatigue resistance were measured before and after aging for various lengths of times at temperatures up to 125°C. Smaller solder joints on smaller pads were shown to be harder and stronger than larger ones, but to age faster and eventually end up softer and weaker.

Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference

Effects of solder alloy, volume and pad finishes on various aspects of micro-structure and the corresponding thermo-mechanical properties of SnAgCu solder joints were investigated. Particular attention was focused on the behavior of solder joints with interlaced Sn grain morphology. Crossed polarized microscopy and scanning electron microscopy (SEM) were used to characterize Sn grain structures. Precipitate sizes and distributions were measured using back-scattered scanning electron microscopy and quantified using image analysis software. Mechanical properties including hardness and indentation creep were measured. Results show that the amount and frequency of interlacing increased as the joint size decreased, as the amount of Ag in the solder increased, and if the joint was reflowed on ENIG substrates. The interlaced structure was harder and more creep resistant compared to the common beach ball morphology. Image analysis results showed this to be related to much higher densities of secondary precipitates in the interlaced regions. A mechanistic understanding of the micro-structure is discussed and recommendations are made as to the design of more reliable solder joints.

Dependence of SnAgCu Solder Joint Properties on Solder Microstructure

Electronic Components & Technology Conference 2011

It is well known that variations in the microstructure of lead free solders greatly affect their thermomechanical properties. Sn grain size, orientation and number, as well as secondary Ag3Sn and Cu6Sn5 precipitate sizes and numbers, are all seen to influence the mechanical response of solder joints during isothermal and thermal cycling. The solidification temperature of a SnAgCu solder joint dramatically affects its microstructure. Generally, smaller solder balls (e.g. CSP) undercool more, and thus their microstructure and properties are very different than larger solder balls (e.g. BGA). We report results of a study of the effects of solder joint volume, and pad sizes, on the microstructure and thermomechanical properties of solder joints. Solder joint shapes and dimensions spanned the ranges typical of BGA and CSP assemblies. Temperatures of solidification during cool-down were quantified by differential scanning calorimetry. Sn grain structures were characterized by crossed polarizer microscopy and scanning electron microscopy with electron backscattered diffraction. Precipitate sizes and distributions were measured using backscattered scanning electron microscopy. Corresponding properties, including hardness, strength and fatigue resistance were measured before and after aging for various lengths of times at temperatures up to 125°C. Smaller solder joints on smaller pads were shown to be harder and stronger than larger ones, but to age faster and eventually end up softer and weaker.

Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference

Effects of solder alloy, volume and pad finishes on various aspects of micro-structure and the corresponding thermo-mechanical properties of SnAgCu solder joints were investigated. Particular attention was focused on the behavior of solder joints with interlaced Sn grain morphology. Crossed polarized microscopy and scanning electron microscopy (SEM) were used to characterize Sn grain structures. Precipitate sizes and distributions were measured using back-scattered scanning electron microscopy and quantified using image analysis software. Mechanical properties including hardness and indentation creep were measured. Results show that the amount and frequency of interlacing increased as the joint size decreased, as the amount of Ag in the solder increased, and if the joint was reflowed on ENIG substrates. The interlaced structure was harder and more creep resistant compared to the common beach ball morphology. Image analysis results showed this to be related to much higher densities of secondary precipitates in the interlaced regions. A mechanistic understanding of the micro-structure is discussed and recommendations are made as to the design of more reliable solder joints.

Effects of Solder Joint Size & Configuration on the Evolution of Mechanical Properties in Aging

Pb-Free Solders & Next Generation Interconnects, Materials Science & Technology 2011

Dependence of SnAgCu Solder Joint Properties on Solder Microstructure

Electronic Components & Technology Conference 2011

It is well known that variations in the microstructure of lead free solders greatly affect their thermomechanical properties. Sn grain size, orientation and number, as well as secondary Ag3Sn and Cu6Sn5 precipitate sizes and numbers, are all seen to influence the mechanical response of solder joints during isothermal and thermal cycling. The solidification temperature of a SnAgCu solder joint dramatically affects its microstructure. Generally, smaller solder balls (e.g. CSP) undercool more, and thus their microstructure and properties are very different than larger solder balls (e.g. BGA). We report results of a study of the effects of solder joint volume, and pad sizes, on the microstructure and thermomechanical properties of solder joints. Solder joint shapes and dimensions spanned the ranges typical of BGA and CSP assemblies. Temperatures of solidification during cool-down were quantified by differential scanning calorimetry. Sn grain structures were characterized by crossed polarizer microscopy and scanning electron microscopy with electron backscattered diffraction. Precipitate sizes and distributions were measured using backscattered scanning electron microscopy. Corresponding properties, including hardness, strength and fatigue resistance were measured before and after aging for various lengths of times at temperatures up to 125°C. Smaller solder joints on smaller pads were shown to be harder and stronger than larger ones, but to age faster and eventually end up softer and weaker.

Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference

Effects of solder alloy, volume and pad finishes on various aspects of micro-structure and the corresponding thermo-mechanical properties of SnAgCu solder joints were investigated. Particular attention was focused on the behavior of solder joints with interlaced Sn grain morphology. Crossed polarized microscopy and scanning electron microscopy (SEM) were used to characterize Sn grain structures. Precipitate sizes and distributions were measured using back-scattered scanning electron microscopy and quantified using image analysis software. Mechanical properties including hardness and indentation creep were measured. Results show that the amount and frequency of interlacing increased as the joint size decreased, as the amount of Ag in the solder increased, and if the joint was reflowed on ENIG substrates. The interlaced structure was harder and more creep resistant compared to the common beach ball morphology. Image analysis results showed this to be related to much higher densities of secondary precipitates in the interlaced regions. A mechanistic understanding of the micro-structure is discussed and recommendations are made as to the design of more reliable solder joints.

Effects of Solder Joint Size & Configuration on the Evolution of Mechanical Properties in Aging

Pb-Free Solders & Next Generation Interconnects, Materials Science & Technology 2011

Effects of Aging on Pb-free Solder Properties in Long Term Service

Journal of Electronic Materials: Pb-Free Solders & Other Materials for Emerging Interconnect & Packaging Technologies, 2011 TMS Annual Meeting & Exhibition

Practical SnAgCu solder joint microstructures are inherently unstable, and resulting properties have been shown to keep changing over periods of years. In the absence of loading this is primarily a result of ongoing coarsening of the secondary precipitates. The sensitivity to this varies with alloy composition, including the addition of Pb in so-called backward compatible assembly, and solder pad finishes as do dependencies on aging temperature. This is further complicated by systematic dependencies on solder volume and reflow parameters. Comparisons between alternatives by accelerated testing may therefore easily be misleading. Effects on life in long term service are however not easily simulated by accelerated preconditioning. In addition, cyclic loading leads to pile-up of dislocations between precipitates, providing for particularly rapid diffusion paths and thus both faster coarsening and different temperature dependencies. Finally, recrystallization and subsequent crack growth are affected strongly by the coarsening. Consequences for long term reliability are discussed.

Dependence of SnAgCu Solder Joint Properties on Solder Microstructure

Electronic Components & Technology Conference 2011

It is well known that variations in the microstructure of lead free solders greatly affect their thermomechanical properties. Sn grain size, orientation and number, as well as secondary Ag3Sn and Cu6Sn5 precipitate sizes and numbers, are all seen to influence the mechanical response of solder joints during isothermal and thermal cycling. The solidification temperature of a SnAgCu solder joint dramatically affects its microstructure. Generally, smaller solder balls (e.g. CSP) undercool more, and thus their microstructure and properties are very different than larger solder balls (e.g. BGA). We report results of a study of the effects of solder joint volume, and pad sizes, on the microstructure and thermomechanical properties of solder joints. Solder joint shapes and dimensions spanned the ranges typical of BGA and CSP assemblies. Temperatures of solidification during cool-down were quantified by differential scanning calorimetry. Sn grain structures were characterized by crossed polarizer microscopy and scanning electron microscopy with electron backscattered diffraction. Precipitate sizes and distributions were measured using backscattered scanning electron microscopy. Corresponding properties, including hardness, strength and fatigue resistance were measured before and after aging for various lengths of times at temperatures up to 125°C. Smaller solder joints on smaller pads were shown to be harder and stronger than larger ones, but to age faster and eventually end up softer and weaker.

Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference

Effects of solder alloy, volume and pad finishes on various aspects of micro-structure and the corresponding thermo-mechanical properties of SnAgCu solder joints were investigated. Particular attention was focused on the behavior of solder joints with interlaced Sn grain morphology. Crossed polarized microscopy and scanning electron microscopy (SEM) were used to characterize Sn grain structures. Precipitate sizes and distributions were measured using back-scattered scanning electron microscopy and quantified using image analysis software. Mechanical properties including hardness and indentation creep were measured. Results show that the amount and frequency of interlacing increased as the joint size decreased, as the amount of Ag in the solder increased, and if the joint was reflowed on ENIG substrates. The interlaced structure was harder and more creep resistant compared to the common beach ball morphology. Image analysis results showed this to be related to much higher densities of secondary precipitates in the interlaced regions. A mechanistic understanding of the micro-structure is discussed and recommendations are made as to the design of more reliable solder joints.

Effects of Solder Joint Size & Configuration on the Evolution of Mechanical Properties in Aging

Pb-Free Solders & Next Generation Interconnects, Materials Science & Technology 2011

Effects of Aging on Pb-free Solder Properties in Long Term Service

Journal of Electronic Materials: Pb-Free Solders & Other Materials for Emerging Interconnect & Packaging Technologies, 2011 TMS Annual Meeting & Exhibition

Practical SnAgCu solder joint microstructures are inherently unstable, and resulting properties have been shown to keep changing over periods of years. In the absence of loading this is primarily a result of ongoing coarsening of the secondary precipitates. The sensitivity to this varies with alloy composition, including the addition of Pb in so-called backward compatible assembly, and solder pad finishes as do dependencies on aging temperature. This is further complicated by systematic dependencies on solder volume and reflow parameters. Comparisons between alternatives by accelerated testing may therefore easily be misleading. Effects on life in long term service are however not easily simulated by accelerated preconditioning. In addition, cyclic loading leads to pile-up of dislocations between precipitates, providing for particularly rapid diffusion paths and thus both faster coarsening and different temperature dependencies. Finally, recrystallization and subsequent crack growth are affected strongly by the coarsening. Consequences for long term reliability are discussed.

Analysis of Two-Machine Flexible Manufacturing Cell Under Unbalanced Machining Time

Journal of Management and Engineering Integration, Vol. 4, No. 2, pp. 26-31, 2011

Dependence of SnAgCu Solder Joint Properties on Solder Microstructure

Electronic Components & Technology Conference 2011

It is well known that variations in the microstructure of lead free solders greatly affect their thermomechanical properties. Sn grain size, orientation and number, as well as secondary Ag3Sn and Cu6Sn5 precipitate sizes and numbers, are all seen to influence the mechanical response of solder joints during isothermal and thermal cycling. The solidification temperature of a SnAgCu solder joint dramatically affects its microstructure. Generally, smaller solder balls (e.g. CSP) undercool more, and thus their microstructure and properties are very different than larger solder balls (e.g. BGA). We report results of a study of the effects of solder joint volume, and pad sizes, on the microstructure and thermomechanical properties of solder joints. Solder joint shapes and dimensions spanned the ranges typical of BGA and CSP assemblies. Temperatures of solidification during cool-down were quantified by differential scanning calorimetry. Sn grain structures were characterized by crossed polarizer microscopy and scanning electron microscopy with electron backscattered diffraction. Precipitate sizes and distributions were measured using backscattered scanning electron microscopy. Corresponding properties, including hardness, strength and fatigue resistance were measured before and after aging for various lengths of times at temperatures up to 125°C. Smaller solder joints on smaller pads were shown to be harder and stronger than larger ones, but to age faster and eventually end up softer and weaker.

Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference

Effects of solder alloy, volume and pad finishes on various aspects of micro-structure and the corresponding thermo-mechanical properties of SnAgCu solder joints were investigated. Particular attention was focused on the behavior of solder joints with interlaced Sn grain morphology. Crossed polarized microscopy and scanning electron microscopy (SEM) were used to characterize Sn grain structures. Precipitate sizes and distributions were measured using back-scattered scanning electron microscopy and quantified using image analysis software. Mechanical properties including hardness and indentation creep were measured. Results show that the amount and frequency of interlacing increased as the joint size decreased, as the amount of Ag in the solder increased, and if the joint was reflowed on ENIG substrates. The interlaced structure was harder and more creep resistant compared to the common beach ball morphology. Image analysis results showed this to be related to much higher densities of secondary precipitates in the interlaced regions. A mechanistic understanding of the micro-structure is discussed and recommendations are made as to the design of more reliable solder joints.

Effects of Solder Joint Size & Configuration on the Evolution of Mechanical Properties in Aging

Pb-Free Solders & Next Generation Interconnects, Materials Science & Technology 2011

Effects of Aging on Pb-free Solder Properties in Long Term Service

Journal of Electronic Materials: Pb-Free Solders & Other Materials for Emerging Interconnect & Packaging Technologies, 2011 TMS Annual Meeting & Exhibition

Practical SnAgCu solder joint microstructures are inherently unstable, and resulting properties have been shown to keep changing over periods of years. In the absence of loading this is primarily a result of ongoing coarsening of the secondary precipitates. The sensitivity to this varies with alloy composition, including the addition of Pb in so-called backward compatible assembly, and solder pad finishes as do dependencies on aging temperature. This is further complicated by systematic dependencies on solder volume and reflow parameters. Comparisons between alternatives by accelerated testing may therefore easily be misleading. Effects on life in long term service are however not easily simulated by accelerated preconditioning. In addition, cyclic loading leads to pile-up of dislocations between precipitates, providing for particularly rapid diffusion paths and thus both faster coarsening and different temperature dependencies. Finally, recrystallization and subsequent crack growth are affected strongly by the coarsening. Consequences for long term reliability are discussed.

Analysis of Two-Machine Flexible Manufacturing Cell Under Unbalanced Machining Time

Journal of Management and Engineering Integration, Vol. 4, No. 2, pp. 26-31, 2011

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Institute of Industrial Engineers (IIE)

Professional Member

Institute of Electrical and Electronics Engineers (IEEE)

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,705315717)

Society of Hispanic Professional Engineers (SHPE)

Professional Member - San Antonio Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Woman Engineers

Professional Member - South Texas Chapter

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)

Society of Automotive Engineers - International

Professional Member

urn:li:fs_position:(ACoAAATXP7sBGw2oHkYR84ymNZ8OQJ22QeB2i10,704508491)