Resume

• 2001

  Doctor of Philosophy (PhD)

  MEMS actuator design and fabrication

  Nanodrill

  perhaps the world's smallest mechanical drill at the time.

  Microelectronics-Photonics

  University of Arkansas at Fayetteville

  Sandia MEMS Advanced Design Short Course

  Sandia Introductory MEMS Short Course

  Electronics Packaging I

  Microelectronics Photonics

  IC Fabrication Techniques

  Electronics Manufacturing

• 1998

  Master of Science (MSc)

  MEMS Packaging

  Mechanical Engineering

  University of Arkansas at Fayetteville

• 1994

  Bachelor of Science (BS)

  Mechanical Engineer

  Microelectronics-Photonics

  MEMS

  Mechanical Engineering

  American Society of Mechanical Engineers

  IEEE

  Society of Automotive Engineers

  University of Arkansas at Fayetteville

• Sensors

  SolidWorks

  Thin Films

  MEMS

  Thermal Analysis

  R&D

  Process Development

  Photolithography

  Simulations

  Wafer bonding

  AutoCAD

  Mechanical Analysis

  Packaging Engineering

  Mechanical Engineering

  COMSOL

  Power Electronics

  Wafer dicing

  Fluid Simulation

  Semiconductors

  Engineering

  O'Neal

  Chad

  O'Neal

  Louisiana Tech University

  APEI (Arkansas Power Electronics International)

  SYSCONN Corporation

  Wolfspeed

  A Cree Company

  Design power packaging modules including high voltage.

  Arkansas Power Electronics International

  Inc. (APEI)

  Wolfspeed

  A Cree Company

  Fayetteville

  Arkansas Area

  Power module engineering process development \nManage the engineering team that owns production equipment and processes\nSpecify and install new equipment and processes\nOversee SPC and tool utilization/controls

  Process Engineering Manager

  Power module design

  project management

  Development Engineer

  Fayetteville

  Arkansas Area

  Wolfspeed

  A Cree Company

  MEMS system and packaging design and fabrication.

  SYSCONN Corporation

  APEI (Arkansas Power Electronics International)

  Fayetteville

  Arkansas

  Design power modules and project manager.

  Senior Staff Engineer

  MEMS packaging including piezoelectrics

  wafer bonding

  and dicing.

  Louisiana Tech University

  American Society of Mechanical Engineers